Patent · US Active

Wafer support system, wafer support device, system comprising a wafer and a wafer support device as well as mask aligner

US10937681B2 · kind B2 · utility

1Cited by

1References

20Claims

0Family size

Assignee

SUSS MICROTEC LITHOGRAPHY GMBH · DE

Inventors

Yasuaki Amano · Munich, DE
Sven Hansen · Hamburg, DE
Lennert Schwart · Munich, DE

Key dates

Filing date	Sep 25, 2018
Grant date	Mar 2, 2021
Priority date	—
Expiry date	Feb 22, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68327
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A wafer support system has a wafer support device and a dicing frame, wherein the wafer support device has a bottom plate and a top plate. The top plate has a support surface for supporting the wafer, and the bottom plate has a maximum diameter being larger than the maximum diameter of the top plate so that the bottom plate forms a repository for the dicing frame. The dicing frame has a plate-like shape defining a center hole, wherein the minimum diameter of the center hole is larger than the maximum diameter of the top plate so that the dicing frame sinks below the upper surface of the wafer and/or the support surface. Further, a wafer support device, a wafer support system and a mask aligner are provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.