Image-capturing element manufacturing method, image-capturing element and image-capturing device
US10937823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2020 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Mar 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image-capturing element manufacturing method includes: preparing a first substrate having a plurality of pixels that are two-dimensionally continuously arrayed; preparing a second substrate having a plurality of circuit blocks that respectively have connection terminals to a power supply and a reference potential and that are electrically independent from each other, each of the plurality of circuit blocks having at least some of circuits to read out signals from the plurality of pixels; laminating the first substrate and the second substrate to electrically couple the plurality of circuit blocks and the plurality of pixels overlapping therewith; and cutting circuit blocks around at least one of the plurality of circuit blocks and pixels overlapping therewith to form a laminate in which the plurality of pixels are laminated onto the at least one of the plurality of circuit blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.