Semiconductor unit, semiconductor device, light-emitting apparatus, display apparatus, and method of manufacturing semiconductor device
US10937929B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Mar 2, 2015 |
| Grant date | Mar 2, 2021 |
| Priority date | — |
| Expiry date | Mar 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
[Solving Means] A semiconductor unit includes a substrate, a semiconductor device, and a plating layer. The semiconductor device includes a semiconductor layer and one or more electrodes, the one or more electrodes being connected to the semiconductor layer and including a platinum-group element as a main material. The plating layer bonds the substrate and the electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.