Ceramic electrostatic chuck having a V-shape seal band
US10943808B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2016 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Nov 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Implementations described herein provide a substrate support assembly that includes a seal band. The seal band protects an adhesive layer that is disposed between an electrostatic chuck (ESC) and a cooling plate of the substrate support assembly. In one example, a substrate support assembly includes an electrostatic chuck and a cooling plate. A bonding layer secures a bottom surface of the electrostatic chuck to a top surface of the cooling plate. The bonding layer has an adhesive layer and a seal band. The seal band circumscribes and protects the adhesive layer. The seal band has a ring shaped body. The ring shaped body has a top surface connected to a bottom surface by an inner surface and an outer surface. The top surface and the bottom surface angled less than 85 degrees from the inner surface. The outer surface has an indent formed therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.