Radio frequency silicon on insulator wafer platform with superior performance, stability, and manufacturability
US10943813B2 · kind B2 · utility
2Cited by
9References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2019 |
| Grant date | Mar 9, 2021 |
| Priority date | — |
| Expiry date | Jun 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6661
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor-on-insulator (e.g., silicon-on-insulator) structure having superior radio frequency device performance, and a method of preparing such a structure, is provided by utilizing a single crystal silicon handle wafer sliced from a float zone grown single crystal silicon ingot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.