MEMS microphone and manufacturing method for making same
US10947110B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2019 |
| Grant date | Mar 16, 2021 |
| Priority date | — |
| Expiry date | Mar 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a manufacturing method for MEMS structure. The method includes steps of: S1: providing a substrate, including a structural layer and a silicon-based layer overlapped with the structural layer; S2: carrying out a main etching process for etching out a cavity hole from an end of the silicon-based layer, which is far away from the structural layer, in a direction toward the structural layer until the cavity hole contacts the structural layer; and S3: carrying out an over-etching process for deepening the cavity hole and control an included angle α between a side wall of the cavity hole and the structural layer to be larger than 10° but smaller than 90°. The invention also provides a MEMS structural and a MEMS microphone manufactured by the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.