Lieng Loo
7Patents
0h-index
6Co-inventors
27Inventor score
Filing activity: Jan 7, 2019 → Dec 29, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11569791B2 | Planarization method | Emerging Cross-Sectional Technologies | 0 | Active |
| US11192782B1 | Method for preparing silicon wafer with rough surface and silicon wafer | Performing Operations; Transporting | 0 | Active |
| US11482664B2 | Planarization method | Electricity | 0 | Active |
| US10818511B1 | Plane polishing method of silicon wafer and processing method of silicon wafer | Electricity | 0 | Active |
| US11305988B2 | Method for preparing silicon wafer with rough surface and silicon wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US10947110B2 | MEMS microphone and manufacturing method for making same | Electricity | 0 | Active |
| US11111134B2 | Method for processing conductive structure | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.