Patent · US Active

High resolution thermopile infrared sensor array having monolithically integrated signal processing

US10948355B2 · kind B2 · utility

0Cited by

1References

15Claims

0Family size

Assignee

Heimann Sensor GmbH · DE

Inventors

Bodo Forg · Mainz, DE
Michael Schnorr · Idstein, DE
Jörg Schieferdecker · Dresden, DE
Karlheinz Storck · Lorch, DE
Marion Simon · Schlangenbad, DE
Wilhelm Leneke · Taunusstein, DE

Key dates

Filing date	Dec 11, 2019
Grant date	Mar 16, 2021
Priority date	—
Expiry date	Dec 11, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH04N23/23
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A high-resolution thermopile infrared sensor array having monolithically integrated signal processing and a plurality of parallel signal processing channels for the signals from pixels of a sensor array, and a digital port for the serial output of the pixel signals are provided, wherein the sensor array is located on one or more sensor chips. The thermal piled infrared sensor array possesses low power loss, high integration density and high thermal and geometric resolution. Each signal processing channel (K1 . . . KN) has at least one analogue/digital converter (ADC), and is assigned a memory region in a memory (RAM) for storing the signals from the pixels (SE).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.