Bodo Forg
8Patents
2h-index
10Co-inventors
44Inventor score
Filing activity: Jan 13, 2011 → Jul 9, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8592765B2 | Thermopile infrared sensor by monolithic silicon micromachining | Electricity | 4 | Active |
| US9945725B2 | Thermopile infrared sensor structure with a high filling level | Physics | 3 | Active |
| US10739201B2 | High-resolution thermopile infrared sensor array | Electricity | 1 | Active |
| US10788370B2 | Thermal infrared sensor array in wafer-level package | Physics | 1 | Active |
| US10948355B2 | High resolution thermopile infrared sensor array having monolithically integrated signal processing | Electricity | 0 | Active |
| US11187589B2 | High-resolution thermopile infrared sensor array | Electricity | 0 | Active |
| US10578493B2 | High resolution thermopile infrared sensor array having monolithically integrated signal processing | Electricity | 0 | Active |
| US11988561B2 | Method for producing a thermal infrared sensor array in a vacuum-filled wafer-level housing | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.