Chemical mechanical polishing apparatus and method
US10953514B1 · kind B1 · utility
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2References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 17, 2019 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Sep 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.