Composition for surface treatment and surface treatment method using the same
US10954479B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Jun 13, 2017 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Jul 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02068
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a composition for surface treatment including: a phosphonic acid compound containing two or more nitrogen atoms; and water, wherein the pH is 6 or less, and the composition for surface treatment is used for treating a surface of a polishing-completed object to be polished having a tungsten-containing layer. According to the present invention, there is provided a means capable of inhibiting dissolution of the tungsten-containing layer provided on a polishing-completed object to be polished when a surface treatment is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.