Image conduction apparatus for soldering inner void analysis
US10957030B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2018 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Sep 26, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30152
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.