Mingman Li
3Patents
1h-index
14Co-inventors
34Inventor score
Filing activity: Aug 14, 2018 → Sep 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10957030B2 | Image conduction apparatus for soldering inner void analysis | Physics | 1 | Active |
| US11904417B2 | Automated material welding | Physics | 0 | Active |
| US11644501B2 | Method for identifying PCB core-layer properties | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.