Integrated circuit packages with patterned protective material

US10957656B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Kyle Yazzie · San Tan Valley, US
• Naga Sivakumar Yagnamurthy · Chandler, US
• Pramod Malatkar · Chandler, US
• Chia-Pin Chiu · Tempe, US
• Mohit Mamodia · Chandler, US
• Mark Gallina · Hillsboro, US
• Rajesh Kumar Neerukatti · Tempe, US
• Joseph Bautista · Gilbert, US
• Michael Drake · Phoenix, US

Key dates

• Filing date: Sep 27, 2017
• Grant date: Mar 23, 2021
• Expiry date: Sep 27, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/73253
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Disclosed herein are integrated circuit (IC) packages with an electronic component having a patterned protective material on a face, as well as related devices and methods. In some embodiments, a computing device may include: an integrated circuit (IC) package with an electronic component having a protective material on the back face of the electronic component, where the protective material is patterned to include an area on the back face of the electronic component that is not covered by the protective material; a circuit board, where the IC package is electrically coupled to the circuit board; and a heat spreader, where the heat spreader is secured to the circuit board and in thermal contact with the area on the back face of the electronic component that is not covered by the protective material.