Indium solder metallurgy to control electro-migration
US10957667B2 · kind B2 · utility
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2References
23Claims
0Family size
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Inventors
Key dates
| Filing date | Oct 1, 2016 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Oct 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments are generally directed to indium solder metallurgy to control electro-migration. An embodiment of an electronic device includes a die; and a package substrate, wherein the die is bonded to the package substrate by an interconnection. The interconnection includes multiple interconnects, and wherein the interconnection includes a solder. The solder for the interconnection includes a combination of tin (Sn), copper (Cu), and indium (In).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.