Yi Li
9Patents
4h-index
30Co-inventors
53Inventor score
Filing activity: Dec 16, 2005 → Sep 5, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7800868B2 | Magnetic sensing device including a sense enhancing layer | Emerging Cross-Sectional Technologies | 23 | Active |
| US8138239B2 | Polymer thermal interface materials | Emerging Cross-Sectional Technologies | 14 | Active |
| US9704735B2 | Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication | Electricity | 13 | Active |
| US7929259B2 | Magnetic sensing device including a sense enhancing layer | Emerging Cross-Sectional Technologies | 8 | Active |
| US10629469B2 | Solder resist layers for coreless packages and methods of fabrication | Electricity | 3 | Active |
| US11443970B2 | Methods of forming a package substrate | Electricity | 1 | Active |
| US12400363B2 | Device and method for improved fiducial marker detection | Electricity | 0 | Active |
| US10957667B2 | Indium solder metallurgy to control electro-migration | Electricity | 0 | Active |
| US11456281B2 | Architecture and processes to enable high capacity memory packages through memory die stacking | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.