Package structure and method of manufacturing the same
US10957672B2 · kind B2 · utility
2Cited by
34References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2017 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Dec 8, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, a second encapsulant, and a plurality of conductive terminals. The first encapsulant is at least disposed between the first die and the second die, and on the second die. The second encapsulant is aside the first die and the second die. The conductive terminals are electrically connected to the first die and the second die through a redistribution layer (RDL) structure. An interface is existed between the first encapsulant and the second encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.