Multilayer transmission line plate
US10957964B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2016 |
| Grant date | Mar 23, 2021 |
| Priority date | — |
| Expiry date | Jul 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.