Inventor · Chikusei, JP

Yuusuke Kondou

13Patents
3h-index
24Co-inventors
56Inventor score

Filing activity: May 30, 2003 → Dec 10, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US7239013B2 Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device Electricity 8 Expired
US7592250B2 Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device Electricity 6 Active
US9397381B2 Electromagnetic coupling structure, multilayered transmission line plate, method for producing electromagnetic coupling structure, and method for producing multilayered transmission line plate Emerging Cross-Sectional Technologies 3 Active
US10506705B2 Multilayer transmission line plate Electricity 2 Active
US10693353B2 Method of manufacturing a magnet plate for a linear motor Emerging Cross-Sectional Technologies 1 Active
US11339251B2 Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board Electricity 1 Active
US11286346B2 Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar Chemistry; Metallurgy 1 Active
US9431886B2 Method of manufacturing a magnet plate for a linear motor Emerging Cross-Sectional Technologies 1 Active
US9806579B2 Magnet plate for linear motor for preventing misalignment of magnets Electricity 0 Active
US10411577B2 Magnet assembly for linear motor having cover member covering magnet plate Electricity 0 Active
US9078365B2 Resin composition, prepreg, laminate, and wiring board Emerging Cross-Sectional Technologies 0 Active
US10957964B2 Multilayer transmission line plate Electricity 0 Active
US12241225B2 Work machine cooling unit fan housing Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.