Patent · US Active

Micro-mechanical sensor and method for manufacturing a micro-electro-mechanical sensor

US10961116B2 · kind B2 · utility

1Cited by

1References

20Claims

0Family size

Assignee

Infineon Technologies Dresden GmbH & Co. KG · DE

Inventors

Dirk Meinhold · Dresden, DE
Steffen Bieselt · Wehlen, DE
Erhard Landgraf · Dresden, DE

Key dates

Filing date	Apr 26, 2019
Grant date	Mar 30, 2021
Priority date	—
Expiry date	Apr 26, 2039

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/038
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A micro-electro-mechanical sensor comprises a first substrate comprising an element movable with respect to the first substrate and a second substrate comprising a first contact pad and a second contact pad. The first substrate is bonded to the second substrate such that a movement of the element changes a coupling between the first contact pad and the second contact pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.