Wafer drying system
US10962285B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2018 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Sep 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A wafer drying method to detect airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process is provided. For example, the method includes dispensing in a wafer drying station a drying gas over one or more wafers; collecting the drying gas from an exhaust of the wafer drying station; determining the concentration of contaminants in the drying gas; re-dispensing the drying gas over the one or more wafers if the concentration of contaminants is higher than a baseline value; and transferring the one or more wafers out of the wafer drying station if the concentration is equal to or less than the baseline value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.