Substrate inspection apparatus
US10962565B2 · kind B2 · utility
0Cited by
0References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2017 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Mar 23, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R35/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
There is provided a substrate inspection apparatus capable of inspecting the electrical characteristics of a packaged semiconductor device in a mounting environment. A prober includes a test box, a probe card and a package inspection card. A packaged device is attached to the package inspection card. A test board of the test box and a card board of the package inspection card reproduce the mounting environment in which a wafer-level system-level test is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.