Device and method for direct liquid cooling via metal channels
US10964625B2 · kind B2 · utility
0Cited by
3References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2019 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Jun 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for direct liquid cooling is disclosed. The device includes a packaged assembly disposed on a substrate. The device also includes a metal channel layer having a plurality of channels disposed on top of the packaged assembly, and a top seal disposed on the metal channel layer. The top seal has at least one inlet and at least one outlet for direct liquid cooling. The metal channel layer includes copper or silver. The packaged assembly can also include silicon channels. In addition, the method of producing the device is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.