Padam Jain
12Patents
1h-index
23Co-inventors
50Inventor score
Filing activity: Dec 22, 2014 → Apr 12, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11488890B2 | Direct liquid cooling with O-ring sealing | Emerging Cross-Sectional Technologies | 1 | Active |
| US12315782B2 | Spring loaded compliant coolant distribution manifold for direct liquid cooled modules | Physics | 0 | Active |
| US12243802B2 | Methods and heat distribution devices for thermal management of chip assemblies | Electricity | 0 | Active |
| US10964625B2 | Device and method for direct liquid cooling via metal channels | Electricity | 0 | Active |
| US9832865B2 | Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards | Electricity | 0 | Active |
| US11955406B2 | Temperature control element utilized in device die packages | Electricity | 0 | Active |
| US12272619B2 | Direct liquid cooling with O-ring sealing | Emerging Cross-Sectional Technologies | 0 | Active |
| US11721641B2 | Weight optimized stiffener and sealing structure for direct liquid cooled modules | Electricity | 0 | Active |
| US11664329B2 | Weight optimized stiffener and sealing structure for direct liquid cooled modules | General | 0 | Revoked |
| US9788416B2 | Multilayer substrate for semiconductor packaging | Electricity | 0 | Active |
| US12424509B2 | Compliant pad spacer for three-dimensional integrated circuit package | Electricity | 0 | Active |
| US11990386B2 | Methods and heat distribution devices for thermal management of chip assemblies | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.