Cooling electronic devices in a data center
US10966352B2 · kind B2 · utility
8Cited by
191References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2018 |
| Grant date | Mar 30, 2021 |
| Priority date | — |
| Expiry date | Sep 24, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.