Laser-releasable bonding materials for 3-D IC applications
US10968348B2 · kind B2 · utility
2Cited by
5References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2018 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Dec 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.