Patent · US Active

Chemical-mechanical processing slurry and methods for processing a nickel substrate surface

US10968377B2 · kind B2 · utility

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Key dates

Filing dateApr 12, 2018
Grant dateApr 6, 2021
Priority date—
Expiry dateApr 16, 2039

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09K3/1463
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Described are chemical mechanical processing (CMP) compositions and related methods, including compositions and methods for polishing nickel phosphorus (NiP) surfaces for hard disk applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.