Patent assignee · US · COMPANY

CMC Materials LLC

29Patents
29Active
29Granted
52Portfolio score

Filing activity: Jan 30, 2015 → Mar 1, 2024

Most-cited patents

PatentTitleAreaCited byStatus
US10920107B2 Self-stopping polishing composition and method for bulk oxide planarization Electricity 1 Active
US11802220B2 Silica-based slurry for selective polishing of carbon-based films Electricity 0 Active
US10946495B2 Low density polishing pad Chemistry; Metallurgy 0 Active
US11807710B2 UV-curable resins used for chemical mechanical polishing pads Chemistry; Metallurgy 0 Active
US11855258B2 Secondary battery cell with solid polymer electrolyte Emerging Cross-Sectional Technologies 0 Active
US11851584B2 Alternative oxidizing agents for cobalt CMP Electricity 0 Active
US11938584B2 Chemical mechanical planarization pads with constant groove volume Chemistry; Metallurgy 0 Active
US12428580B2 CMP composition including an anionic abrasive Electricity 0 Active
US11492514B2 Derivatized polyamino acids Chemistry; Metallurgy 0 Active
US11629271B2 Titanium dioxide containing ruthenium chemical mechanical polishing slurry Electricity 0 Active
US12234382B2 CMP composition including anionic and cationic inhibitors Electricity 0 Active
US10968366B2 Composition and method for metal CMP Electricity 0 Active
US11845156B2 Polishing pad employing polyamine and cyclohexanedimethanol curatives Chemistry; Metallurgy 0 Active
US12227673B2 Composition and method for silicon nitride CMP Chemistry; Metallurgy 0 Active
US11384253B2 Dual additive composition for polishing memory hard disks exhibiting edge roll off Physics 0 Active
US10968377B2 Chemical-mechanical processing slurry and methods for processing a nickel substrate surface Chemistry; Metallurgy 0 Active
US11637317B2 Solid polymer electrolyte compositions and methods of preparing same Emerging Cross-Sectional Technologies 0 Active
US11440158B2 Coated compressive subpad for chemical mechanical polishing Performing Operations; Transporting 0 Active
US11043151B2 Surface treated abrasive particles for tungsten buff applications Electricity 0 Active
US11034862B2 Polishing composition and method utilizing abrasive particles treated with an aminosilane Electricity 0 Active
US11597854B2 Method to increase barrier film removal rate in bulk tungsten slurry Chemistry; Metallurgy 0 Active
US10988635B2 Composition and method for copper barrier CMP Electricity 0 Active
US12398293B2 Composition and method for polishing boron doped polysilicon Chemistry; Metallurgy 0 Active
US11845157B2 Chemical mechanical planarization pads via vat-based production Chemistry; Metallurgy 0 Active
US11725116B2 CMP composition including a novel abrasive Electricity 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.