Defect discovery using electron beam inspection and deep learning with real-time intelligence to reduce nuisance
US10970834B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Jul 13, 2018 |
| Grant date | Apr 6, 2021 |
| Priority date | — |
| Expiry date | Apr 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A deep learning algorithm is used for defect discovery, such as for semiconductor wafers. A care area is inspected with the wafer inspection tool. The deep learning algorithm is used to identify and classify defects in the care area. This can be repeated for remaining care areas, but similar care areas may be skipped to increase throughput.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.