Patent · US Active

Ground shield plane for ball grid array (BGA) package

US10971455B2 · kind B2 · utility

0Cited by

7References

7Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Aniket PATIL · Tempe, US
Kuiwon Kang · San Diego, US
Zhijie Wang · 梅厂镇, CN
Ming Yi · Shanghai, CN

Key dates

Filing date	May 1, 2019
Grant date	Apr 6, 2021
Priority date	—
Expiry date	May 1, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Certain aspects of the present disclosure provide an integrated circuit (IC) package and techniques for fabricating the IC package. The IC package generally includes a substrate, an IC disposed above the substrate, and a shielding layer coupled to a layer of the substrate, wherein the shielding layer is disposed above the substrate adjacent to the IC, and below an upper surface of the IC.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.