Device chip and method of manufacturing device chip
US10978347B2 · kind B2 · utility
0Cited by
0References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 16, 2019 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Sep 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10156
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device chip for mounting on a board is provided. The device chip includes a top surface, an undersurface located on an opposite side from the top surface and having a larger area than the top surface, a slope inclined with respect to the top surface and the undersurface and exposed to the top surface side, a circuit portion on the top surface side, the circuit portion including an electronic circuit, and a wiring portion on which wiring electrically connecting the circuit portion and the board to each other is to be formed, the wiring portion including the slope in a part of the wiring portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.