Semiconductor package including EMI shielding structure and method for forming the same
US10978406B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2018 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Jun 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package structure including an encapsulating layer, a package substrate, and a conductive shielding layer is provided. The package substrate has a device region covered by the encapsulating layer and an edge region surrounding the device region and exposed from the encapsulating layer. The package substrate includes an insulating layer and a patterned conductive layer in a level of the insulating layer. The patterned conductive layer includes conductors in and along the edge region. The edge region is partially exposed from the conductors, as viewed from a top-view perspective. The conductive shielding layer covers and surrounds the encapsulating layer and is electrically connected to the conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.