Method for manufacturing optical sensor arrangements and housing for an optical sensor
US10978507B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2017 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Oct 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
Abstract
A method for manufacturing optical sensor arrangements is provided. The method comprises providing at least two optical sensors on a carrier and providing a cover material on the side of the optical sensors facing away from the carrier. The method further comprises providing an aperture for each optical sensor on a top side of the cover material facing away from the carrier and forming at least one trench between the optical sensors from the carrier towards the top side of the cover material, the trench comprising inner walls. Moreover, the method comprises coating the inner walls with an opaque material, such that an inner volume of the trench is free of the opaque material, and singulating of the optical sensor arrangements along the at least one trench. Furthermore, a housing for an optical sensor is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.