Bernhard Stering
7Patents
1h-index
7Co-inventors
36Inventor score
Filing activity: Apr 17, 2012 → Oct 19, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9842946B2 | Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method | Electricity | 2 | Active |
| US10256147B2 | Dicing method | Electricity | 1 | Active |
| US9961777B2 | Method for cutting a carrier for electrical components | Emerging Cross-Sectional Technologies | 1 | Active |
| US10978507B2 | Method for manufacturing optical sensor arrangements and housing for an optical sensor | Electricity | 0 | Active |
| US9917012B2 | Dicing method for wafer-level packaging and semiconductor chip with dicing structure adapted for wafer-level packaging | Electricity | 0 | Active |
| US9105645B2 | Method for producing thin semiconductor components | Electricity | 0 | Active |
| US10217715B2 | Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.