Methods for fabricating printed circuit board assemblies with high density via array
US10980127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2019 |
| Grant date | Apr 13, 2021 |
| Priority date | — |
| Expiry date | Jun 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for forming a printed circuit board (PCB) assembly. The method may include drilling a first plurality of vias having a first diameter in a PCB and filling the first plurality of vias to form a first plurality of plated or filled vias. The method may also include drilling a second plurality of vias having a second diameter in the PCB, and filling the second plurality of vias to form a second plurality of plated or filled vias. The first plurality of plated or filled vias is mixed with the second plurality of plated or filled vias such that the spacing between the first plurality of plated or filled vias and the second plurality of plated or filled vias is less than the first diameter and the second diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.