Substrate treatment method and substrate treatment apparatus
US10985040B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2018 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | May 25, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/802
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A substrate treatment method in accordance with an exemplary embodiment includes: heating a substrate, for a substrate treatment process, so that a temperature of the substrate reaches a target temperature; calculating the temperature of the substrate using a sensor located facing the substrate while heating the substrate; and controlling an operation of a heating part configured to heat the substrate according to the temperature calculated from the calculating the temperature, wherein the calculating the temperature comprises: measuring a total radiant energy (Et) radiated from the substrate using the sensor; calculating a corrected total emissivity (εt0) by applying a correction value for correcting the total emissivity (εt) which is the emissivity of the radiant energy (Et); and calculating the temperature (Ts) of the substrate using the total radiant energy (Et) and the corrected total emissivity (εt0).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.