Semiconductor manufacturing apparatus and driving method of the same
US10985047B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Jul 25, 2018 |
| Grant date | Apr 20, 2021 |
| Priority date | — |
| Expiry date | Feb 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturing apparatus includes a temperature stabilizer, a chuck, an actuator, and a controller. The temperature stabilizer is on a plane defined by a first direction and a second direction crossing the first direction. The chuck supports and rotates a wafer and passes through a center of the temperature stabilizer. The actuator is connected to the temperature stabilizer and moves the temperature stabilizer in a third direction crossing to the first and second directions. The controller controls driving of the actuator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.