Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
US10988852B2 · kind B2 · utility
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13References
12Claims
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Key dates
| Filing date | Oct 27, 2015 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | Feb 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76898
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Copper electroplating baths containing primary alcohol alkoxylate block copolymers and ethylene oxide/propylene oxide random copolymers having specific HLB ranges are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.