Resin composition
US10990008B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2017 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | Feb 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/53295
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a resin composition which can result in a cured film which has chemical resistance, low stress property, and high elongation property even by a heat treatment at a low temperature.The resin composition comprising an alkali-soluble resin (a) which contains a phenol skeleton having a crosslinking group and a phenol skeleton not having a crosslinking group and which has a weight average molecular weight in the range of 1,000 to 50,000, wherein the content ratio of the phenol skeleton having a crosslinking group to the total 100% by mole of structural units of the phenol skeleton having a crosslinking group and the phenol skeleton not having a crosslinking group is in the range of 5 to 90% by mole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.