Circuit substrate
US10993332B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2020 |
| Grant date | Apr 27, 2021 |
| Priority date | — |
| Expiry date | Jan 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit substrate includes a substrate, a wire build-up layer structure, and an insulating layer. The substrate has a first surface and a second surface opposites to the first surface. The substrate includes a plurality of patterned pads. The patterned pads are disposed on the first surface of the substrate, and having contact openings. The wire build-up layer structure is disposed on the first surface of the substrate. The wire build-up layer structure includes an interconnect build-up layer and a plurality of conductive pillars. The conductive pillars electrically connect to the interconnect build-up layer and the patterned pads. The insulating layer is disposed between the substrate and the wire build-up layer structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.