Over-molded IC package with in-mold capacitor

US10998261B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Jackson Chung Peng Kong · Merang, MY
• Bok Eng Cheah · Air Itam, MY
• Wen Wei Lum · Kampung Sungai Pau, MY
• Mooi Ling Chang · Bayan Lepas, MY
• Ping Ping Ooi · Butterworth, MY

Key dates

• Filing date: May 8, 2018
• Grant date: May 4, 2021
• Expiry date: May 8, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19105
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Over-molded IC package assemblies including an in-mold capacitor. In some embodiments, an over-molded package assembly includes a IC chip or die coupled to one or more metal distribution layer or package substrate. A molding compound encapsulates at least the IC chip and one or more capacitors are fabricated within the molding compound. The capacitors may include two or more metal plates separated by an intervening dielectric material, all of which are embedded within a trench in the molding compound. Individual ones of the capacitor plates may physically contact a conductive land of the package redistribution layer or package substrate, for example to tie the plates to a ground plane and power plane, or two supply rails, in a decoupling capacitor application.