Patent · US Active

Hybrid focal-plane array and method of manufacturing the same

US10998372B1 · kind B1 · utility

0Cited by
3References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 18, 2019
Grant dateMay 4, 2021
Priority date
Expiry dateNov 6, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10F39/809

Abstract

A method of manufacturing a hybrid focal-plane array includes: forming a read-out integrated circuit with integral bending slit; forming a detector die separately from the read-out integrated circuit and including a detector with integral bending slit; and joining the read-out integrated circuit and the detector die to each other such that the read-out bending slit and the detector bending slit are aligned with each other.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.