Hybrid focal-plane array and method of manufacturing the same
US10998372B1 · kind B1 · utility
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20Claims
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Key dates
| Filing date | Apr 18, 2019 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | Nov 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/809
Abstract
A method of manufacturing a hybrid focal-plane array includes: forming a read-out integrated circuit with integral bending slit; forming a detector die separately from the read-out integrated circuit and including a detector with integral bending slit; and joining the read-out integrated circuit and the detector die to each other such that the read-out bending slit and the detector bending slit are aligned with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.