Ryan Freeman
4Patents
1h-index
6Co-inventors
27Inventor score
Filing activity: Jun 25, 2018 → Apr 19, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10748957B1 | Method of manufacturing a curved semiconductor die | Physics | 3 | Active |
| US11848349B1 | Curved semiconductor and method of forming the same | Electricity | 1 | Active |
| US10815771B2 | Thermal regulation and vibration isolation system | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US10998372B1 | Hybrid focal-plane array and method of manufacturing the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.