Cooler device with superconductor shunts

US10998485B1 · kind B1 · utility

Assignee

• NORTHROP GRUMMAN SYSTEMS CORPORATION · US

Inventors

• John X. Przybysz · Penn Hills, US
• Robert M. Young · Ellicott City, US
• Aaron Ashley Hathaway · Baltimore, US
• Edward R. Engbrecht · Hopewell Junction, US
• Monica P. Lilly · Frederick, US

Key dates

• Filing date: Jan 13, 2020
• Grant date: May 4, 2021
• Expiry date: Jan 13, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N60/805
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A solid state cooler device is disclosed that includes a first superconductor shunt, a first normal metal pad disposed on the first superconductor shunt, and a first insulator layer and a second insulator layer disposed on the normal metal pad and separated from one another by a gap. The solid state cooler device also includes a first superconductor pad disposed on the first insulator layer and a second superconductor pad disposed on the second insulator layer, a first conductive pad coupled to the first superconductor pad, and a second conductive pad coupled to the second superconductor pad. Hot electrons are removed from the first normal metal pad when a bias voltage is applied between the first conductive pad and the second conductive pad, wherein the first superconductor shunt facilitates even current distribution through the device.