Edward R. Engbrecht
11Patents
3h-index
26Co-inventors
60Inventor score
Filing activity: Apr 16, 2004 → Aug 1, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7144803B2 | Methods of forming boron carbo-nitride layers for integrated circuit devices | Electricity | 14 | Expired |
| US7338893B2 | Integration of pore sealing liner into dual-damascene methods and devices | Electricity | 11 | Expired |
| US8796150B2 | Bilayer trench first hardmask structure and process for reduced defectivity | Electricity | 4 | Active |
| US10998485B1 | Cooler device with superconductor shunts | Electricity | 3 | Active |
| US9269607B2 | Wafer stress control with backside patterning | Electricity | 1 | Active |
| US8395228B2 | Integration process to improve focus leveling within a lot process variation | Physics | 0 | Active |
| US11839165B2 | Cooler device with aluminum oxide insulators | Emerging Cross-Sectional Technologies | 0 | Active |
| US12426504B2 | Solid-state cooler device with grid point contacts | Electricity | 0 | Active |
| US11600760B2 | Cooler device with aluminum oxide insulators | Emerging Cross-Sectional Technologies | 0 | Active |
| US11333413B2 | Solid state cooler device | Emerging Cross-Sectional Technologies | 0 | Active |
| US11950510B2 | Superconductor junction for a solid state cooler | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.