Method of wire bonding a first and second circuit card
US10999938B1 · kind B1 · utility
1Cited by
11References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2020 |
| Grant date | May 4, 2021 |
| Priority date | — |
| Expiry date | Apr 29, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.