Sensor package and method of producing the sensor package
US11001495B2 · kind B2 · utility
0Cited by
5References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 14, 2017 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Jun 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The sensor package comprises a carrier (1) including electric conductors (13), an ASIC device (6) and a sensor element (7), which is integrated in the ASIC device (6). A dummy die or interposer (4) is arranged between the carrier (1) and the ASIC device (6). The dummy die or interposer (4) is fastened to the carrier (1), and the ASIC device (6) is fastened to the dummy die or interposer (4).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.