Package structure
US11002927B2 · kind B2 · utility
2Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2019 |
| Grant date | May 11, 2021 |
| Priority date | — |
| Expiry date | Feb 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2054
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.