Inventor · Taichung, TW

Cheng-Ting Chen

48Patents
6h-index
38Co-inventors
69Inventor score

Filing activity: Sep 7, 1999 → Feb 18, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9263839B2 System and method for an improved fine pitch joint Electricity 66 Active
US6692985B2 Solar cell substrate with thin film polysilicon Emerging Cross-Sectional Technologies 12 Expired
US8440503B1 Methods for performing reflow in bonding processes Electricity 11 Active
US8901726B2 Package on package structure and method of manufacturing the same Emerging Cross-Sectional Technologies 11 Active
US9437564B2 Interconnect structure and method of fabricating same Electricity 9 Active
US9799631B2 Semiconductor packaging structure and method Electricity 8 Active
US10566261B2 Integrated fan-out packages with embedded heat dissipation structure Electricity 6 Active
US6277667A Method for fabricating solar cells Emerging Cross-Sectional Technologies 5 Expired
US8674496B2 System and method for fine pitch PoP structure Electricity 5 Active
US9412689B2 Semiconductor packaging structure and method Electricity 4 Active
US9373603B2 Reflow process and tool Electricity 4 Active
US9768137B2 Stud bump structure for semiconductor package assemblies Electricity 4 Active
US10879203B2 Stud bump structure for semiconductor package assemblies Electricity 3 Active
US9230935B2 Package on package structure and method of manufacturing the same Emerging Cross-Sectional Technologies 3 Active
US10015888B2 Interconnect joint protective layer apparatus and method Emerging Cross-Sectional Technologies 3 Active
US8629053B2 Plasma treatment for semiconductor devices Electricity 3 Active
US10535644B1 Manufacturing method of package on package structure Electricity 2 Active
US10512124B2 Warpage control in the packaging of integrated circuits Electricity 2 Active
USD977582S1 Toy car General 2 Active
US9538582B2 Warpage control in the packaging of integrated circuits Electricity 2 Active
US11432372B2 Warpage control in the packaging of integrated circuits Electricity 2 Active
US11002927B2 Package structure Electricity 2 Active
US10903090B2 Method of singulate a package structure using a light transmitting film on a polymer layer Electricity 1 Active
US9935044B2 Semiconductor packaging and manufacturing method thereof Electricity 1 Active
US9281288B2 System and method for fine pitch PoP structure Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.