Fingerprint sensor device and methods thereof

US11003884B2 · kind B2 · utility

Assignee

• QUALCOMM Incorporated · US

Inventors

• Nicholas Ian Buchan · San Jose, US
• Mario Francisco Velez · San Diego, US
• Chin-Jen Tseng · Fremont, US
• Hrishikesh Vijaykumar Panchawagh · Rochester, US
• Firas Sammoura · Dublin, US
• Jessica Liu Strohmann · Cupertino, US
• Kostadin Dimitrov Djordjev · Los Gatos, US
• David William Burns · Minneapolis, US
• Leonard Eugene Fennell · San Jose, US
• Jon Aday · Gilbert, US

Key dates

• Filing date: Feb 10, 2017
• Grant date: May 11, 2021
• Expiry date: Jul 4, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/40
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A fingerprint sensor device includes a sensor substrate, a plurality of sensor circuits over a first surface of the sensor substrate, and a transceiver layer located over the plurality of sensor circuits and the first surface of the sensor substrate. The transceiver layer includes a piezoelectric layer and a transceiver electrode positioned over the piezoelectric layer. The piezoelectric layer and the transceiver electrode are configured to generate one or more ultrasonic waves or to receive one or more ultrasonic waves. The fingerprint sensor device may include a cap coupled to the sensor substrate and a cavity formed between the cap and the sensor substrate. The cavity and the sensor substrate may form an acoustic barrier.